Wafer mounter / Film mounter laminates wafer, dicing frame and some tapes without bubbles prior to the singulation/dicing process.
Technovision's wafer mounter is a wide range of equipment from R&D to semi-production, it can be selected according to the purpose.
It supports a wide range of uses around the following.
It apply the dicing tape on the back for holding the chip after dicing the wafer.
It apply adhesive tape(DAF) for fixing to the substrate before die-bonding chips.
It apply the tape for protection circuit to protect the surface when grinding the back of the wafer
for thinning of the wafer.
■Support tape ( film )
Dual purpose equipment for normal tape and pre-cut tape.
Dedicated equipment for normal tape.
Dedicated equipment for pre-cut tape.
12 inch (300mm), 8 inch (200mm)、6inch (150mm) Each model depends on the wafer sizes.
(Please see the following matrix.)
Improvement of yield is possible due to "stable work","high quality manufacturing process" and
prevention of fly-chips" with installation of wafer mounter.
The wafer mounter is available in the following four basic series, with selectable functions
and wafer sizes.
・FM-334 series(semi-automatic) : small table-top
・FM-664 series(semi-automatic) : Both pre-cut tape and normal tape support
・FM-903 series(semi-automatic) : Dedicated for normal tape