Furukawa Electric

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Non -UV Tape for Wafer Backgrinding
This tape is designed for surface protection of semiconductor wafers during the backgrinding proc..
UV-Tape for BGA/CSP Package Dicing
A new innovative adhesive tape for BGA/CSP package dicing. No Package Flying! Appli..
UV-Tape for Wafer Backgrinding & Etching
A new innovative adhesive tape for wafer backgrinding and etching. SP tape's excellent shock ..
UV-Tape for Wafer Dicing
A new innovative adhesive tape for wafer dicing, that allows Full Cut Method. The high adhesi..