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Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages
MGC


Non-haloganated BT Materials

These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.

 

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL832NX
Type A
GHPL-830NX
Type A
0.06, 0.1, 0.15, 0.2-0.8(0.1step), 0.25, 0.35, 0.45mm 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm


Features

CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages. Its properties are essentially the same as those of the thin IC package material CCL-HL832HS / GHPL-830HS.

Typical applications

Fully Green IC packages.
 


 

Non-haloganated Low CTE BT Materials
 

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL832NS
GHPL-830NS
0.04,0.05,0.06,0.1,0.15,
0.24,0.25,0.3,0.4(0.1step),
0.46mm
0.025,0.03,0.035,0.04,
0.045,0.05,0.06,0.1mm

Features

Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
Superior heat resistance after moisture absorption because of low moisture absorption
30microns copper clad laminate and 25microns prepreg are available

Typical applications

Substrates for CSP,FC-PKG,BGA,PGA
 

Typical properties of Materials
 
Item Condition Unit HL832NX
(A)
HL832NS HL832NS
typeLC
HL832NS
typeHD
Dielectric Constant
 
1GHz
4.9
4.4
4.0
4.3
 
5GHz
4.8
4.3
3.9
4.2
 
10GHz
4.7
4.3
3.9
4.2
Dissipation Factor
 
1GHz
0.011
0.006
0.006
0.006
 
5GHz
0.011
0.008
0.007
0.008
 
10GHz
0.012
0.008
0.008
0.008
Insulation Resistance
 
C-96/20/65
Ω
1015-16
1015-16
1015-16
1015-16
Surface Resistance
 
C-96/20/65
Ω
1015-16
1015-16
1015-16
1015-16
Volume Resistivity
 
C-96/20/65
Ω・cm
1015-16
1016-17
1016-17
1016-17
Flexural Strength
 
   
MPa
450
490
750
480
Flexural Modulus
 
   
GPa
28
27
30
26
Tensile Strength
 
   
MPa
270
290
400
310
Young's Modulus
 
   
GPa
28
27
30
26
Glass Transition Temp.
 
DMA
 
230
255
255
255
TMA
 
200
230
230
230
DSC
 
190
210
210
210
Cofficent of Thermal Expansion
 
X,Y
α1
ppm/℃
14
10
7
10
X,Y
α2
ppm/℃
5
3
3
3
Peel Strength
 
 
12μm
KN/m
0.85
1.0
1.0
1.0
Flame Resistance
 
E-168/70
V-0
V-0
V-0
V-0
Density
   
g/cm3
2.1
1.9
1.9
1.9
Heat capacity
   
J/g・K
1.00
1.00
0.95
0.95
Poissin's ratio
   
0.19
0.18
0.18
0.18
Moisture absorption
 
85 ℃/85RH% 168h
%
0.44
0.31
0.30
0.31
  • *MGC also has halogen free materials, CCL-HL820, CCL-HL820W, and CCL-HL820WDB.

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