|[Buff construction : Flap]|
|Grit type : Silicon Carbide
Grade(JIS) : 220,240,400,600,800
Hardness : S,M,H
Clear Buff was developed for cleaning hole-filling ink from BGA substrates and for surface conditioning of dielectric resin of build-up printed boards. The main efforts are on its high abrasion power, while minimizing the mechanical distortion (elongation) of the board caused by the scrubbing force. The clogging of the buff surface is also minimized and high durability is materialized.