A new innovative adhesive tape for wafer dicing, that allows Full Cut Method.
The high adhesion of UC tape prevents chip flying and makes it possible to minimize chipping during dicing. Its adhesive becomes non-sticky when exposed to UV light. Even large chips, therefore can be easily picked up, virtually no stress and no adhesive residue.
The above are typical charactristics, and should not be used for any specification purpose. Properties and characteristics are different between kinds and types. Please contact us for the details of the respective tapes.