Fully Automatic Wafer Tape Remover

Brand: CUON Solution Co., Ltd
Product Code: CUWRA-120 / CUWRA-080
Availability: Inquiry Basket
Application Wafer 8'' & 12''
Wafer Thickness 200um (8")
300um (12")
Wafer Warpage 4mm>=
Application Tape Non UV and UV Tape
Main Controller PLC
Data and GUI PC
Tape Tension Control Yes
Peel bar Temperature 180ºC +/- 5
Peeling Angle Adjustable Yes
Wafer Center Accuracy +/- 0.5 mm
Wafer Angle 0,90,180,270 Deg
Chuck Temperature 60ºC +/- 5ºC
Chuck table Material POROUS
Vision Alignment Yes
Chuck Surface Cleaning Yes
Tape Consumption 30~40mm
UV Feature Yes
UPH 8inch: 60 Wafer/Hour
12inch: 50 Wafer/Hour
note: Based on UV tape @50mm/sec

  • FOUP cassette loader
  • DSC cassette (for thin wafer)
  • Barcode system.
  • Wafer ID reader.
  • Hepa filter.
  • SECS/GEM interface.
  • Static eliminator.

Power Supply AC220V +/-10%
Phase Single
Frequency 50/60Hz
Amphere 30A
Air Supply 5.0Kgf/cm2
Dimension for 12”, 8” machine   2300x1600x1850(LxDxH) approx. 1400kg

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