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  • Model 616B-001 Digital Ultrasonic Peg Bonder
Model 616B-001 Digital Ultrasonic Peg Bonder
HYBOND, Inc.


Overview

Model 616B-001 Digital Ultrasonic Peg Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire.

Applications include "tacking" tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding , and ball coining.

When fitted with a WP-280 and OP-75, the 616B-001 becomes a semiautomatic machine for medium to high volume production.

Standard Features

  • Hybond Soft Touch energy system
  • Independent Z-axis lever for bonding tool control
  • Motorized vertical wire feed
  • 1-1-2, 1-2-2 & 1-2-1 stitch capability
  • 0.5 and 2 inch spool mounts
  • Loop height control adjustment
  • Front panel wire feed control for manual tail adjustment
  • Swing-away wire clamp assembly
  • Deep vertical access of 0.59" (1,49cm)
  • Long horizontal reach of 6.5 in. (16,5cm)
  • Deep access Wire-In-Tool 90° wire feed
  • Wire and ribbon bonding capability
  • Independent control of 1st & 2nd bond parameters
  • Tail length adjustable in .003" increments
  • Audio & visual bond sequence fault indicators
  • 10x12 in. (25,4x30,3 cm) X-Y work platform
  • LED display of work stage temperature
  • Infinite angle microscope mounting
  • Front panel ultrasonic test button


Optional Features

  • Leica Stereo Zoom microscope (OP-06S6T)
  • Nikon SMZ660 microscope (OP-06A)
  • Dual fiber-optic illuminator (OP-08A)
  • 240 VAC 50/60 Hz input wiring (OP-12)
  • 8:1 X-Y Manipulator (OP-30)
  • Tool heater with temperature controller (OP-31)
  • Heated Ultrasonic Transducer (OP-83)
  • High & low ultrasonic power (OP-44)
  • 2.125" diameter heated workstage (WST-15A)
  • 4" x 4" heated workstage (WST-19B)

Specifications

» Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range: 0-1 watt on Low setting (default), 0-2 watts on High setting
» Bond Time Range: 10 - 400 mSec
» Bond Force Range: 15 - 150 grams
» Temperature Control Range: Ambient to 250° C
» Bondable Wire Diameters: 0.5 to 2.0 mils (12,7 to 50,8 µm)
» Bondable Wire Materials: Gold and aluminum
» Bondable Ribbon Dimensions: Up to 1 x 10 mils (25,4 x 254 µm)
» Bondable Wire /Ribbon Materials: Gold and aluminum
» Bond Head Movement: Manual
» Bond Actuation: Switch at fixed height, actuated by lever
» Z Axis Travel: 0.5 in (1,20 cm) maximum
» Vertical Bonding Window: 60 -100 mils (152-254 µm)
» Table Motion: 4:1, manual
» Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Minimum Bench Space Required: 20.0 x 25.0 in. (50,8 x 63,5cm)
» Unit Weight /Shipping Weight: 70 lbs (31,8Kg)/150 lbs. Shipping weight will vary.
» Industry Standards: CE certified

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